Your location:Flux spraying and soldering are integrated on the same platform, with a small footprint, low energy consumption, low cost, and fast expansion. It is suitable for high production capacity requirements, as well as intelligent software for small batch single mach···
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Small footprint and low energy consumption
Modular design, flexible expansion of sub modules, and arbitrary combination according to requirements
Modular independent operation, expandable splicing, and single machine use
Low cost, fast expansion, suitable for high production capacity needs and small batch single machine production
| Technical specifications for wave soldering equipment | |
|---|---|
| Basic Parameters | |
| Equipment size (L × W × H) | 2565mm × 1750mm × 1527mm |
| Equipment weight | 1285KG |
| Processing Capability | |
| Track range (including fixtures) | 60-500mm |
| Maximum weight of PCB | 15KG |
| PCB upper component height | Max: 120mm |
| PCB lower component height | Max: 60mm |
| spray system | |
| Number of nozzles | Single nozzle |
| Spray type | Dot spray/line spray/arc spray |
| Nozzle nozzle size | 130μm |
| Preheating system | |
| Preheating temperature range | Room temperature~250 ℃ |
| Bottom preheating method | Shortwave infrared spotlight |
| Top preheating method | hot air recirculation |
| Tin Furnace System | |
| Tin pump type | electromagnetic pump |
| Tin furnace capacity | 12KG |
| level detection | Digital liquid level detection |
| temperature control accuracy | ±1℃ |
| temperature range | Room temperature~320 ℃ |
| Tin wave height detection | Laser sensor detection |
| Sports Performance | |
| Positioning speed (Max) | 400mm/s |
| Z-axis velocity (Max) | 150mm/s |
| Z-axis travel | 60mm |
| Welding accuracy | ±0.05mm |
| Intelligent Control | |
| Width adjustment method | Automatic width adjustment (± 0.1mm) |
| Programming method | Visual demonstration/coordinate demonstration/image interaction |
| Offset correction | Support coordinate recognition and offset correction |