650 Series - Selective Wave Soldering F-HS650

Flux spraying, preheating, and soldering are integrated on the same platform with small footprint, low energy consumption, low cost, and fast expansion. It is suitable for high production capacity requirements, as well as intelligent software for small batch s···

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Product Description

Flux spraying, preheating, and soldering integrated on the same platform

Small footprint and low energy consumption

Low cost, fast expansion, suitable for high production capacity requirements, and also suitable for small batch single machine production

Intelligent software, easy to operate, visual and image interactive programming

Visual demonstration, coordinate demonstration, coordinate recognition, offset correction


Technical Specifications
Technical specifications for wave soldering equipment
Basic Parameters
Equipment size (L × W × H)1940mm × 1600mm × 1527mm
Equipment weight902KG
Processing Capability
Track range (including fixtures)60-350mm
Maximum weight of PCB15KG
PCB upper component heightMax: 120mm
PCB lower component heightMax: 60mm
spray system
Number of nozzlesSingle nozzle
Spray typeDot spray/line spray/arc spray
Nozzle nozzle size130μm
Preheating system
Preheating temperature rangeRoom temperature~250 ℃
Bottom preheating methodShortwave infrared spotlight
Top preheating methodhot air recirculation
Tin Furnace System
Tin pump typeelectromagnetic pump
Tin furnace capacity12KG
level detectionDigital liquid level detection
temperature control accuracy±1℃
temperature rangeRoom temperature~320 ℃
Tin wave height detectionLaser sensor detection
Sports Performance
Positioning speed (Max)400mm/s
Z-axis velocity (Max)150mm/s
Z-axis travel60mm
Welding accuracy±0.05mm
Intelligent Control
Width adjustment methodAutomatic width adjustment (± 0.1mm)
Programming methodVisual demonstration/coordinate demonstration/image interaction
Offset correctionSupport coordinate recognition and offset correction