Flux spraying, preheating, and soldering integrated on the same platform
Small footprint and low energy consumption
Low cost, fast expansion, suitable for high production capacity requirements, and also suitable for small batch single machine production
Intelligent software, easy to operate, visual and image interactive programming
Visual demonstration, coordinate demonstration, coordinate recognition, offset correction
| Technical specifications for wave soldering equipment | |
|---|---|
| Basic Parameters | |
| Equipment size (L × W × H) | 1000mm × 1180mm × 1600mm |
| Equipment weight | 476KG |
| processing power | |
| Track range (including fixtures) | 10-330mm |
| Maximum weight of PCB | 15KG |
| PCB upper component height | Max: 300mm |
| PCB lower component height | Max: 60mm |
| spray system | |
| Number of nozzles | Single nozzle |
| Spray type | Dot spray/line spray/arc spray |
| Nozzle nozzle size | 130μm |
| Tin Furnace System | |
| Tin pump type | mechanical pump |
| Tin furnace capacity | 7KG |
| level detection | High and low sensors |
| temperature control accuracy | ±1℃ |
| temperature range | Room temperature~300 ℃ |
| Tin wave height detection | Laser sensor detection |
| Sports Performance | |
| Positioning speed (Max) | 300mm/s |
| Z-axis velocity (Max) | 100mm/s |
| Welding accuracy | ±0.05mm |
| Intelligent Control | |
| Programming method | Visual demonstration/coordinate demonstration/image interaction |
| Offset correction | Support coordinate recognition and offset correction |